Introduction, SOLIDWORKS Basics and the User Interface, Introduction to Sketching, Basic Part Modeling Symmetry and Draft, Patterning, Revolved Features, Shelling and Ribs, Editing: Repairs, Editing: Design Changes, Configurations.
Advanced Mate Techniques, Top- Down Assembly Modeling, Assembly Features, Smart Fasteners and Smart Components, Assembly Editing, Using Configurations with Assemblies, Layout-based Assembly Design, Large Assemblies.
Drawing Sheets and Views, Dimension, Annotations, Assembly Drawing Views, Sheet Formats and Templates, Bill of Materials and Tables, Drawing References and Comparison.
Multi-body Design Techniques, Saving Solid Bodies, Sketching with Splines, Introduction to Sweeping, Working with Curves, Advanced Sweeping, Boundary Feature and Lofting.
The Analysis Process, Mesh Controls, Stress Concentrations and Boundary Conditions, Assembly Analysis with Contacts,Symmetrical and Free Self- Equilibrated Assemblies, Assembly Analysis with Connectors and Mesh Refinement, Compatible / Incompatible Meshes, Analysis of Thin Components, Mixed Meshing Shells and Solids, Mixed Meshing Solids, Beams and Shells.
Frequency Analysis of Parts, Frequency Analysis of Assemblies, Buckling Analysis, Thermal Analysis, Thermal Analysis with Radiation, Fatigue Analysis, Drop Test Analysis.
Introduction to Motion Simulation and Forces, Building a motion model and post processing. Introduction to contacts, springs and dampers. Advanced contact. Curve to curve contact. Motion optimization. Flexible joints. Redundancies, Export to FEA, Event based simulation.
Introduction to Nonlinear structural analysis. Geometric nonlinear analysis. Material Models and constitutive relations. Numerical procedure for nonlinear FEA, Contact Analysis, Large Displacement Analysis, Nonlinear static buckling analysis. Plastic deformation. Hardening rules. Nonlinear contact analysis.
Vibration of a Pipe, Transient shock analysis according to MILS-STD- 81OG, Harmonic Analysis of a Bracket, Response spectrum analysis. Nonlinear Dynamic Analysis of an Electronic Enclosure.